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Key FeaturesData Center OptimizedWeb ServerEnterprise ServerManaged HostingShort Depth1. Dual socket P (LGA 3647) supportsIntel® Xeon® Scalable Processors,Dual UPI up to 10.4GT/s 2. Up to 1TB ECC 3DS LRDIMM, up toDDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x8 (FHHL) slot 4. 8 Hot-swap 2.5" SATA3 drive bays, 1 Slim DVD-ROM drive (optional),Opt

od 1667
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SuperBlade®Enclosure SBE-720EProcessor BladeUp to 10 hot-plug Twin processor bladesModule SupportSupports Intel based Twinblade®Supports Intel and AMD based 10-bladeLEDPower LED, Fault LED

od 5622
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1. Intel® Atom® Processor E3940,Single Socket FCBGA 1296 2. System-on-Chip 3. 1 Full size Mini-PCIe 1 M.2 2280 B-Key for SATA or PCIe SSD 4. 1 non-ECC DDR3L SODIMM; up to 8GB 5. Dual GbE LAN ports via Intel I210-AT

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Key Features 1. Dual socket R3 (LGA 2011) supportsIntel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up toDDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot 4. 8x 2.5" SAS3 and 8x 2.5" SATA3Hot-swap Drive Bays 5. Quad GbE ports w/ Intel i350 6. I/O ports: 2 SuperDOM, 1 V

od 2496
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Supermicro (CSE-813MFTQC-350CB) Supermicro CSE-813MFTQC-350CB počítačová skrinka Skriňa Čierna 350 W

od 383
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Server mini tower určený pre procesory Intel Xeon processor E3-1200 sériu.Soket LGA 1155 (nepodporuje Core i3),  Motherboard Super X9SCL, Intel? C202 PCH chipset. Pamäť max 32GB, 4 sloty pre 1333/1066MHz ECC DDR3. Rozširujúce sloty 2x  PCI-E x8 2.0, 1s PCI-E x4 2.0 v x8 slote.  6x Serial ATA2 3,0 Gbsec, podpora RAID 0, 1, 5, 10. 4x tool less 3,5" pozície, 2x 5,25" pozície. Sieťová karta Intel? 82579LM and 82574L, 2x Gigabit LAN, grafika Matrox G200eW 16MB DDR2. Konektory 2x PS/2,  2x RJ-45, 2x USB2.0, 1x sériový port.  Zdroj 300W 80+. Zostava je BAREBONE t.j.bez HDD, procesora, pamäte atd. Rozmery 362x184x425mm, Hmotnosť 10 kg.

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 Integrated BoardSuper X11DPX-TViews: | Angled View | Top View | | Front View

od 2712
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1. Dual Socket P (LGA 3647) supportIntel® Xeon® Scalable Processors 2. Up to 3TB 3DS ECC LRDIMM, up toDDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 Low-profile slots 4. 32 Hot-swap Ruler SSDs, individualSSD power cycling

od 6479
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Product SKUs  SYS-F628R3-RTBPTN+SuperServer F628R3-RTBPTN+ (Black)  Motherboard  Super X10DRFR-NT  Processor/Cache  

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Product SKUs  MicroBladeMBI-6119G-T8HX    Motherboard    B2SS1-H-MTF  Processor/Cache  CPUSi

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Product SKUs  SYS-2028TP-DECFRSuperServer 2028TP-DECFR (Black)  Motherboard (Two per System)  Super X10DRT-PIBF  Processor/

od 5202
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Key Features 1. 700W Redundant Power SuppliesGold Level Certified 2. 4x 3.5" Hot-swap SAS / SATA DriveBays 3. 1x Slim DVD-ROM Drive (optional) 4. 4x 4cm Counter-rotating PWM Fans 5. 2x Full-height I/O Expansion Slots & 1x Low-profile I/O Expansion Slot 6. Power Switch, Reset, UID Button & 5 LED Indicators 7. Full SES2 support is available with SAS motherboards and o

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1. Dual socket R3 (LGA 2011) supportsIntel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up toDDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16 Low-profile slot 4. Intel® i350 Dual port GbE LAN

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1. Intel® Xeon® processor D-2123IT, 4-Core, 8 Threads, 60W 2. System on Chip 3. 1 Internal 2.5" drive bay 4. Up to 512GB ECC LRDIMM, up to 256GB ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 5. 1 onboard OCuLink port (or 1 PCI-E 3.0 x4 NVMe), 1 PCI-E 3.0 x8 (LP) open slot 6. 2x 10GBase-T LAN and 1 dedicatedLAN for IPMI 2.0 7. 1 VGA, 2 USB 3.0, 1 TPM 2.0 header 8. 3x 40x28mm 4-PIN PWM Fan 9. 150W Lockable DC Power Adapter

od 1046
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1. Intel® Xeon® D-2146NT Processor, 8-Core, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2133Mz; in 4 DIMM slots 3. 1 PCI-E 3.0 x16, 1 Mini PCI-E x1 4. Up to 4x 2.5" drive bays5. 1 M.2 M-Key for storage: 2242/2280,1 M.2 B-Key for SSD & WAN: 2242

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1. Intel® Xeon® processor D-2123IT, 4-Core, 8 Threads, 60W 2. 1 Internal 3.5" or 4 Internal 2.5" drive bays 3. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot 4. Up to 512GB ECC LRDIMM, up to 256GB ECC/non-ECC DIMMDDR4-2666Mz; in 4 DIMM slots 5. 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0 6. 1 VGA, 2 USB 3.0 7. 3x 40x28mm 4-PIN PWM fans 8. 200W Low-noise AC-DC power supply

od 1482
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1. Dual socket R (LGA 2011) supportsIntel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC LRDIMM, 512GB ECCRDIMM, up to 1866MHz; 16x DIMM sockets 3. 1x PCI-E 3.0 x16 Low-profile slot; 1x PCI-E 3.0 x8 Low-profile slot 4. Intel® i350-AM2 Dual port GbE LAN

od 3972
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1. Single socket P (LGA 3647) supportsIntel® Xeon® Phi™ x200 processor, optional integrated Intel® Omni-Path fabric, CPU TDP support Up to 260W 2. Up to 384GB ECC LRDIMM, 192GB ECCRDIMM, DDR4-2400MHz in 6 DIMM slots 3. 2 PCI-E 3.0 x16 (Low-profile) slots 4. Intel® i350 Dual port GbE LAN 5. 1 Dedicated IPMI LAN port

od 7435
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1. Dual socket R3 (LGA 2011) supportsIntel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up toDDR4- 2400†MHz ; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (low-profile) slots 2 PCI-E 3.0 x8 (low-profile) slotsM.2 Interface: PCI-E 3.0 x4M.2 Form Factor: 2260, 2280, 221104. Dual 1GbE LAN with Intel® i350 5. 16 Hot-swap 2.5" SATA/SAS drives;Supports 8 NVMe drives 6. 8x 92mm cooling fans 7. 2200W Redundant (2+2) PowerSupplies; Titanium Level (96%+)

od 9932
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Enterprise MicroBlade6U W/4x2000W DC PSU(2x CMM support)Intel® E3 and E5 based server bladesPower LED, Fault LEDUp to 2 hot-swap MBM-GEM-001 or MBM-XEM-001 switchesUp to 2 hot-swap Chassis Management Modules (CMM) providing remote KVM and IPMI 2.0 functionalities 4 PWS-2K02D-BR hot-swap high-efficiency 2000W, N+1 or N+N redundant DC power suppliesDC Power cables (CBL-PWEX-0980-1) are not included in the enclosure 8 cooling fans 10.43" x 17.67" x 36.10" (265mm x 449mm x 917mm)

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1. Intel® Xeon® D-2123IT Processor, 4-Core, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 (FHFL) slots 4. 2 Internal 2.5" SSD bays 5. M.2: 1 M-Key, 2280/22110; 1 E-Key, 2230; 1 B-Key, 2242/3042 6. 9 GbE (1 port for management), 4x 10G SFP+, and 1 Dedicated IPMI LAN 7. 2 USB 3.0, 1 VGA, 1 COM via RJ45 8. 600W Redundant Power Supplies

od 2038
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1. Dual Node Twin Architecture, 2x computeEach node controls 45 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECCDDR4-2933MHz† RDIMM/LRDIMM,Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMeM.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power SuppliesTitanium Level (96%)

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8th Generation Intel® Core™ i7-8665UEProcessor; Single Socket FCBGA-1528,System-on-Chip,M.2: M-Key 2242/2280, E-Key, 2230, B-Key 2242/2280,Up to 64GB Unbuffered Non-ECC,SO-DIMM DDR4 2400MHz; 2 DIMM slots,Dual GbE LAN w/ Intel i219LM + i210IT

od 1244
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Počet jadier: 40Počet vlákien: 80Frekvencia: 2.30 GhzMax frekvencia turba: 3.40 GhzPamäť L3 Cache: 60 MBTDP: 270 W

od 4046
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1. 200 CPUs per 42U Rack 2. Dual socket P+ (LGA-4189) supports 3rd Gen Intel® Xeon® Scalable processors 3. Intel® C621A chipset 4. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 5. 2 Hot-plug 2.5" NVMe/SAS3/SATA3 drive bays; 1 NVMe M.2 6. Dual 25G onboard Ethernet 7. IPMI 2.0, KVM over IP, Virtual Media over LAN8. Graphics: Aspeed AST26009. Cooling: Passive CPU heatsink CPU1: SNK-P1044V CPU2: SNK-P0077V

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1. Mini 1U Chassis, Optimized for Intel Atom Platforms 2. 200W Low Noise Power Supply 3. 1x 3.5" Internal Drive Bay 4. OR 2x 2.5" InternalDrive Bay (Optional) 5. OR 1x Full-height, Half-lengthPCI Expansion Slot (Optional)

od 121
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Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors 8x DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM 2x PCI-E Gen4 x16 FHFL slot 2x 2.5" drive bays; 1x M.2 NVMe OR 1x M.2 SATA3 5x hot-swappable counter rotated fans with optimal fan speed controlRedundant 600W DC Power SuppliesFront-access I/O: 2x 10GBased-T, 1x Dedicated IPMI, 2x USB3.0, 2x USB2.0, 1x COM, 1x VGA

od 2080
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Intel® Celeron® 6305E Processor;Single Socket FCBGA-1449System-on-ChipM.2: B-Key, M-Key, E-KeyM.2 2242/3042/2280 B-Key (USB3.0/2.0, SATA Gen3/PCI-E Gen3 x1) with nano SIM holder M.2 2230 E-Key (CNVi/PCI-E 3.0 x1/USB2) M.2 2242/2280 M-Key (PCI-E 4.0 x4), NVMe supportUp to 64GB Unbuffered Non-ECCSO-DIMM DDR4 3200MHz; 2 DIMM slotsDual 2.5GbE LAN w/ Intel I225-IT

od 640
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Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)Up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMsExpansion slots:Up to 2 PCI-E 4.0 x16 (FH/HL) slots: 24-NVMe configuration (Standard) – 1 slotavailable 20-NVMe configuration – 2 slots availableM.2 Interface: 2 PCI-E 4.0 x2M.2 Form Factor: 2280, 22110M.2 Key: Onboard M-keyIntegrated IPMI 2.0 + KVM with dedicated LANSoftware Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 2x 10GBase-T LAN ports via Broadcom BCM57416Up to 24 hot-swap 2.5" U.2 NVMe drive bays 1200W Redundant Power Supplies Titanium Level (96%)

od 3392
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Single Socket H5 (LGA-1200) supports Intel® Xeon® E-2300 series, Intel® Pentium® processors 4 DIMMs; Up to 128GB of DDR4 ECC UDIMM memory with speeds of up to 3200MHz 1 PCI-E 4.0 x8 (in x16 FHHL)Intel® Ethernet Controller i210 2x 1GbE RJ45 1 Fixed 3.5" drive support (default); Up to 2 Fixed 3.5" drives or 3 Fixed 2.5" drives (opt.); Onboard 1x NVMe M.2Single Platinum 350W Power Supply

od 804
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