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Key Features 1. 650W Redundant Power Supply 2. 4x 3.5" Hot-swap SAS / SATA DriveBays 3. 1x Slim DVD-ROM Drive 4. 4x 4cm Counter-rotating PWM Fans 5. 1x Full-height Universal I/O (UIO Expansion Slot) 6. 1x Full-height, Full-length I/OExpansion Slot 7. 1x Low-profile I/O Expansion Slot 8. Power Switch, Reset, UID Button & 5 LED IndicatorsPlease Note: Full SES2 Supp

od 687
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1. Octa Socket P (LGA 3647) supportIntel® Xeon® Scalable Processors 2. Up to 12TB 3DS ECC LRDIMM, up toDDR4-2666MHz; 96 DIMM slots 3. 23 or 39 (OEM) PCI-E 3.0 slots include: 8 FH x16 PCI-E cards or 8 GPUs or 16U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 2 LP x8 (in x16) PCI-E internal cards (storage module) + 5 FHHL x16 PCI-E cards (rear)(Up to 39 PCI-E 3.0 slots for OEM) 4. 4 10Gb LAN (SIOM), 1 dedicated LAN forIPMI Remote Management, 1 VGA, 2 USB 2.0, 1 COM via KVM 5. 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards) 6. 8x 9cm Hot-swap counter-rotating rear fans 7. 5x 1600W (N+2) Redundant PowerSupplies, Titanium Level (96%)

od 24362
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8th Generation Intel® Core™ i7-8665UEProcessor; Single Socket FCBGA-1528,System-on-Chip,M.2: M-Key 2242/2280, E-Key, 2230, B-Key 2242/2280,Up to 64GB Unbuffered Non-ECC,SO-DIMM DDR4 2400MHz; 2 DIMM slots,Dual GbE LAN w/ Intel i219LM + i210IT, 4 COM (RS-232/422/485), 4 USB 3.1, 1 DIO via DB9 7. 1 HDMI and 1 Display Port 8. Fanless design 9. Lockable 12V DC 60W power adapter

od 1104
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1. Intel® Atom® processor C3758,Single socket FCBGA 1310 2. System on Chip 3. 1 Fixed 2.5" drive bay when AOC area is not occupied 4. Up to 256GB registered ECC, up to 64GB unbuf. ECC/non-ECC,DDR4-2400MHz, in 4 DIMM slots 5. 1 PCI-E 3.0 x4 AOC slot (LP) 6. 8 GbE and 2 1G SFP LAN ports 7. 2 USB 3.0, 1 M.2 B Key 3042/2280, 1 M.2 M Key 2242/2280 8. 1 VGA via BMC 9. 1x 40mm chassis fan, passiveCPU heat sink 10. 84W DC power adapter

od 1021
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1. Intel® Xeon® D-2183IT Processor, 16-Core, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 4 PCI-E 3.0 x8 slots for optional AIOM 4. 2x 2.5" drive bays (one drive space shares with M.2), 2 E1.S (30°C ambient temperature only) 5. 2 M.2 M-Key: 2280/22110 (space share with one 2.5" drive bay),1 M.2 E-Key: 2230,1 M.2 B-Key: 3042

od 4435
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1. Intel® Xeon® D-2146NT Processor, 8 Cores, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W Multi-outputGold Level Power Supply

od 2508
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uBladeXEON D-2163IT 12C 2 Nodes/Sled)support NVMe and10GIntel® Xeon® processor D-2163IT,FCBGA 2518, 12 core, 24 Threads, 75WUp to 128GB ECC VLP RDIMMDDR4-2133MHz in 4 DIMM slots 1x 2.5" HDD/SSD/NVMe U.2 per nodeDual 10GbE LAN portsHot-plug front loading

od 4614
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Intel® Atom® processor C3558,Single socket FCBGA 1310System on ChipUp to 2 SSD when AOC area is not occupied. Need optional cable CBL-SAST-1034Up to 256GB registered ECC, up to 64GB unbuf. ECC/non-ECC,DDR4-2400MHz, in 4 DIMM slots 1 PCI-E 3.0 x4 AOC slot (LP) 4 GbE LAN ports w/ Intel C3000 SoC 2 USB 2.0, 1 M.2 M Key 2242/2280 1 VGA via BMC 2x 40mm chassis fan, passive CPU heat sink 84W DC power adapter

od 708
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1. Quad Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 48 DIMMs; up to 12TB 3DS ECCDDR4-2933MHz† RDIMM/LRDIMM,Supports Intel® Optane™ DCPMM†† 3. 6 PCI-E 3.0 x16 slots, 10 PCI-E 3.0 x8 slotsUp to 6 double width passive GPUs 4. 4x 10GBase-T LAN ports viaAOC-4UR66-I4XTF-P 5. 24 Hot-swap 3.5" SAS3/SATA3 drive bays supported via optional Add-onRAID controller card; 8 Hybrid ports with NVMe support via optional AOC 6. 8x 9cm heavy duty fans 7. 1600W (3+1) Redundant PowerSupplies, Platinum Level (96%)

od 7896
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1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W Redundant -48Vdc PowerSupplies with PMbus (92% Efficiency)

od 2303
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1. High Availability StorageAppliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power SuppliesTitanium Level Certified

od 3211
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Single Socket H5 (LGA-1200) supports: 10th Gen. Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor,Intel® Xeon® W-1200 ProcessorsIntel® W480E chipset 2 Fixed 2.5" drive bays with bracket (when AOC area is not occupied)Or 1 Fixed 2.5" drive bay with AOC supportUp to 64GB DDR4 ECC/non-ECC SO-DIMM,DDR4-2933MHz, in 2 DIMM slots 1 PCI-E 3.0 x16 (16/NA or 8/8); 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280; 1 M.2 E-Key CNVi/PCI-E 3.0 x1, 2230

od 698
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Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe 12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hyprid Ports); 2 rear SATA 2.5" slots; onboard 1 M.2 NVMe 3 heavy duty fans with optimal fan speed control; 1 Air ShroudBroadcom® 3816 Controller

od 3412
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1. NEBS Level 3 Certified 2. Dual Socket P (LGA 3647):Intel® Xeon® Gold 6240R 3. 24 DIMMs; up to 1.5TB 3DS ECCDDR4-2933MHz† RDIMM 4. Up to 8 PCI-E Add-on Cards 5. Flexible LAN options 6. 6 Hot-swap 2.5" drive bays 6 NVMe/SATA ports (NVMe from CPU1) or 6 SATA ports 7. 6 Hot-swap Heavy duty 6cm PWM fans 8. 1600W Redundant Power SuppliesTitanium Level (96%) 9. GPU Support (Optional)

od 3220
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Supports Intel based bladesSupports one hot-plug Gigabit Ethernet switch / Pass-Through ModuleOne management module comes standard with each enclosureOne hot-plug management modules providing remote KVM and IPMI 2.0 functionalities

od 3078
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Kompaktný server HPE ProLiant DL365 Gen10 Plus 1U, ktorý možno prispôsobiť rôznym pracovným zaťaženiam a prostrediam, poskytuje vyšší výkon so správnou rovnováhou medzi rozšíriteľnosťou a hustotou. Server HPE ProLiant DL365 Gen10 Plus, navrhnutý pre maximálnu všestrannosť a odolnosť.

od 9074
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Key Features • High Efficiency Power &High Storage Capacity 1. Extra High-Density 4U Storage Chassis 2. High-Availability Features: Redundant,Hot-pluggable cooling system, PowerSupplies, Hot-swap drives 3. Redundant (1+1) 1400W Gold Level power supply with PMBus function 4. Maximum 3.5" hot-swap drives density 36x (24 front + 12 rear) HDD bays; E26 -

od 2314
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Popis produktu: 1. 600W High-efficiency Power Supply with Digital Switching Control 2. 8x 3.5" Hot-swap SAS / SATA DriveBays 3. 1x Slim DVD-ROM Drive (Optional) 4. Adjustable Air Shroud 5. 7x Low-profile, Full-length I/OExpansion Slots 6. 1x Serial, 2x USB Front Access I/O (optional) 7. 2x Fixed 3.5" Drive Bays 8. Full SES2 support is available with SAS motherboa

od 465
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Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable ProcessorsIntel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 2 PCI-E 4.0 x16 (LP), 1 PCI-E 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)Intel® X710 Dual port 10GBase-T LAN onboard 6x 2.5" hot-swap SATA/SAS drive bays 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)

od 8860
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1U Rackmount with single 315W PSUSupports Intel® Xeon® E-2300 and 10th Gen Intel® Pentium® series processors 4 DIMM slots (2DPC), supports DDR4 ECC/non-ECC UDIMM 2 Hot-swap 2.5'' SATA/NVMe drive bays, 1 fixed 3.5'' SATA drive bays or 1 Slim ODD (optional)Supports 1 M.2 (PCIe3.0 x2 or SATA 6Gb/s) 2 RJ45 (1GbE) by Intel® i210VGA, HDMIRemote Management (IPMI)

od 1004
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Powered by dual-socket 3rd Gen Intel Scalable processors and 16 3200 MHz DIMM per nodeOne PCIe 4.0 x16 slot per nodeOne OCP 3.0 module per nodeA total of 8 panel storage bays for a combination of NVMe, SATA and SAS drivesOnboard Broadcom® 3008 SAS 12 Gbps controller for RAID or SAS driveHigh power-efficiency with redundant 3000 W 80 Plus® Titanium power supplies

od 8094
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Single AMD EPYC™ 7002 series processor family 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management portOnboard 12Gb/s SAS expander 24 x 2.5" SATA/SAS hot-swappable HDD/SSD bays in front side 2 x 2.5" SATA/SAS hot-swappable HDD/SSD bays in rear sideUltra-Fast M.2 with PCIe Gen3 x4 interface 6 x PCIe Gen4 / Gen3 expansion slots 1 x OCP 2.0 Gen3 x16 mezzanine slotAspeed® AST2500 remote management controller 800W 80 PLUS Platinum redundant power supply

od 2644
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Single Intel® Quark™ SoC X1021,CPU TDP support 2.2W, 1x Micro SDHC up to 32GB internal slot,Onboard 512MB DDR3 ECC memory,Expansion slots: 2x Mini-PCI-E slots, 1x ZigBee module socket

od 548
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1U chassis, support motherboard sizes: ATX 12" x 10" and Micro ATX 9.6" x 9.6" 4 x 3.5" hot-swap SAS3/SATA drive baySAS or enterprise SATA HDD only recommended 4-port 1U SAS3 12Gbps Hybrid backplane, support up to 4x 3.5-inch SAS3/SATA3/NVMe Storage Devices 1U 400W Redundant Power Supply Platinum with PMBUS, W54.5xL220xH40mm 1 full height expansion slot(s) 4 x 40x28mm PWM fan(s)Optional 2 x fans for AOC cooling

od 794
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CHIEFTEC UNC-411E-B rack 19" 4U / 400 W zdroj / USB 3.0

od 231
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,supermicro assembled as-2013s-c0r 12c/24t model 7272 (2.9/3.2ghz)64gb ddr4, 256gb nvme m.2 2u rack

od 1642
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AMD EPYC 9004 dual-processor 1U server that supports up to 24 DIMM, 12 NVMe, 3 PCIe 5.0 slots, 2 M.2

od 4790
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Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDPIntel® C741 16 DIMM Slots up to 4TB (with Intel® Optane™ Persistent Memory support)Optional AIOM module or PCIe 5.0 x16Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE

od 6841
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2U dual-socket server powered by 4th Gen Intel Xeon Scalable processors that supports 32 DIMMs, 9 PCIe 5.0 slots, 14 NVMe, OCP 3.0, ASUS ASMB11-iKVM, and up to 4 dual-slot GPUs

od 4614
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HPE ProLiant MicroServer Gen10 Plus v2 predstavuje kompaktný server základnej úrovne, ktorý môžete jednoducho prispôsobiť svojim požiadavkám. Dokáže obslúžiť tiež cloud alebo dátové centrum. Súčasne sa jedná o najkompaktnejší MicroServer od HPE, ktorý môžete umiestniť na ležato aj na výšku. Nechýba ani 4× 1 Gb integrovaná sieťová karta a USB 3.2 Gen2 typu A. A či už chcete server pre všeobecné účely, NAS alebo dokonca virtualizačné server, budete prekvapení, koľko toho môžete z tohto malého a cenovo dostupného modelu získať. Kľúčové vlastnosti servera HPE ProLiant MicroServer Gen10 Plus v2Spoľahlivý procesor Intel Xeon E 2314ProLiant MicroServer Gen10 Plus v2 obsahuje 4× USB 3.2Podporuje horizontálne i vertikálne inštaláciuNajkompaktnejšie server od HPE

od 1120
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