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Product SKUs  SYS-2028TP-HC0TRSuperServer 2028TP-HC0TR (Black)  Motherboard (Four per System)  Super X10DRT-PT  Processor/C

od 6121
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Product SKUs  SYS-F628R3-FTSuperServer F628R3-FT (Black)  Motherboard  Super X10DRFF  Processor/Cache  CPU

od 4399
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Product SKUs  SYS-F628R3-FT+SuperServer F628R3-FT+ (Black)  Motherboard  Super X10DRFF-IG  Processor/Cache  CPU

od 4420
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1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot,   2 PCI-E 3.0 x8 (FH/HL) slots,   2 PCI-E 3.0 x8 (LP) slots   M.2 Interface: PCI-E 3.0 x4    (NVMe based)  M.2 Form Factor: 2280, 22110  M.2 Key: Onboard M-key  Number of M.2: Dual

od 2166
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Key Features 1. 650W Redundant Power Supply 2. 4x 3.5" Hot-swap SAS / SATA DriveBays 3. 1x Slim DVD-ROM Drive 4. 4x 4cm Counter-rotating PWM Fans 5. 1x Full-height Universal I/O (UIO Expansion Slot) 6. 1x Full-height, Full-length I/OExpansion Slot 7. 1x Low-profile I/O Expansion Slot 8. Power Switch, Reset, UID Button & 5 LED IndicatorsPlease Note: Full SES2 Supp

od 687
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1. Octa Socket P (LGA 3647) supportIntel® Xeon® Scalable Processors 2. Up to 12TB 3DS ECC LRDIMM, up toDDR4-2666MHz; 96 DIMM slots 3. 23 or 39 (OEM) PCI-E 3.0 slots include: 8 FH x16 PCI-E cards or 8 GPUs or 16U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 2 LP x8 (in x16) PCI-E internal cards (storage module) + 5 FHHL x16 PCI-E cards (rear)(Up to 39 PCI-E 3.0 slots for OEM) 4. 4 10Gb LAN (SIOM), 1 dedicated LAN forIPMI Remote Management, 1 VGA, 2 USB 2.0, 1 COM via KVM 5. 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards) 6. 8x 9cm Hot-swap counter-rotating rear fans 7. 5x 1600W (N+2) Redundant PowerSupplies, Titanium Level (96%)

od 24362
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8th Generation Intel® Core™ i7-8665UEProcessor; Single Socket FCBGA-1528,System-on-Chip,M.2: M-Key 2242/2280, E-Key, 2230, B-Key 2242/2280,Up to 64GB Unbuffered Non-ECC,SO-DIMM DDR4 2400MHz; 2 DIMM slots,Dual GbE LAN w/ Intel i219LM + i210IT, 4 COM (RS-232/422/485), 4 USB 3.1, 1 DIO via DB9 7. 1 HDMI and 1 Display Port 8. Fanless design 9. Lockable 12V DC 60W power adapter

od 1104
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1. Intel® Atom® processor C3758,Single socket FCBGA 1310 2. System on Chip 3. 1 Fixed 2.5" drive bay when AOC area is not occupied 4. Up to 256GB registered ECC, up to 64GB unbuf. ECC/non-ECC,DDR4-2400MHz, in 4 DIMM slots 5. 1 PCI-E 3.0 x4 AOC slot (LP) 6. 8 GbE and 2 1G SFP LAN ports 7. 2 USB 3.0, 1 M.2 B Key 3042/2280, 1 M.2 M Key 2242/2280 8. 1 VGA via BMC 9. 1x 40mm chassis fan, passiveCPU heat sink 10. 84W DC power adapter

od 1021
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1. Quad Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 48 DIMMs; up to 12TB 3DS ECCDDR4-2933MHz† RDIMM/LRDIMM,Supports Intel® Optane™ DCPMM†† 3. 5 PCI-E 3.0 x8 slots, 2 PCI-E 3.0 x16 slots 4. 1 GbE LAN ports via Intel i210 1 dedicated IPMI LAN port 5. 2 Hot-swap 2.5" SATA3 drive bays 8 Hot-swap 2.5" U.2 NVMe SSD bays 6. 2 M.2 M key (22110/2280) 7. 4 heavy duty fans with optimal fan speed control 8. 2200W Redundant Power SuppliesTitanium Level (96%)

od 4043
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1. Intel® Xeon® D-2183IT Processor, 16-Core, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 4 PCI-E 3.0 x8 slots for optional AIOM 4. 2x 2.5" drive bays (one drive space shares with M.2), 2 E1.S (30°C ambient temperature only) 5. 2 M.2 M-Key: 2280/22110 (space share with one 2.5" drive bay),1 M.2 E-Key: 2230,1 M.2 B-Key: 3042

od 4435
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1. Intel® Xeon® D-2146NT Processor, 8 Cores, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W Multi-outputGold Level Power Supply

od 2508
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uBladeXEON D-2163IT 12C 2 Nodes/Sled)support NVMe and10GIntel® Xeon® processor D-2163IT,FCBGA 2518, 12 core, 24 Threads, 75WUp to 128GB ECC VLP RDIMMDDR4-2133MHz in 4 DIMM slots 1x 2.5" HDD/SSD/NVMe U.2 per nodeDual 10GbE LAN portsHot-plug front loading

od 4614
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Intel® Atom® processor C3558,Single socket FCBGA 1310System on ChipUp to 2 SSD when AOC area is not occupied. Need optional cable CBL-SAST-1034Up to 256GB registered ECC, up to 64GB unbuf. ECC/non-ECC,DDR4-2400MHz, in 4 DIMM slots 1 PCI-E 3.0 x4 AOC slot (LP) 4 GbE LAN ports w/ Intel C3000 SoC 2 USB 2.0, 1 M.2 M Key 2242/2280 1 VGA via BMC 2x 40mm chassis fan, passive CPU heat sink 84W DC power adapter

od 708
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1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 2x 3.5" SATA3 by default; 2x 2.5" hybrid SATA3/NVMe w/ Optional kits 3. 4 DIMMs; up to 1TB 3DS ECCDDR4-2933MHz† RDIMM/LRDIMM,Supports Intel® Optane™ DCPMM†† 4. 2 GbE LAN ports via Intel i350 5. 1 Centralized IPMI management port 6. 1 PCI-E 3.0 x16 (low-profile), 1 Micro-LP, and 2 M.2 7. 2 USB 2.0, 1 VGA, 1 COM port, (with KVM dongle) 8. 4x 8cm hot-swap cooling fans with fan speed control (per system) 9. 2200W Redundant Power SuppliesTitanium Level Certified (per system)

od 8656
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1. Quad Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 48 DIMMs; up to 12TB 3DS ECCDDR4-2933MHz† RDIMM/LRDIMM,Supports Intel® Optane™ DCPMM†† 3. 6 PCI-E 3.0 x16 slots, 10 PCI-E 3.0 x8 slotsUp to 6 double width passive GPUs 4. 4x 10GBase-T LAN ports viaAOC-4UR66-I4XTF-P 5. 24 Hot-swap 3.5" SAS3/SATA3 drive bays supported via optional Add-onRAID controller card; 8 Hybrid ports with NVMe support via optional AOC 6. 8x 9cm heavy duty fans 7. 1600W (3+1) Redundant PowerSupplies, Platinum Level (96%)

od 7896
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1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMMDDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W Redundant -48Vdc PowerSupplies with PMbus (92% Efficiency)

od 2303
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1. High Availability StorageAppliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power SuppliesTitanium Level Certified

od 3211
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Single AMD EPYC™ 7002 Series ProcessorUp to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slotsExpansion slots: 1 PCI-E 4.0 x16 (LP Riser), 1 PCI-E 4.0 x16 (for AIOM)AIOM Network card, 1 dedicated IPMI LAN port 1 VGA, 2 USB 3.0 ports

od 12466
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Single Socket H5 (LGA-1200) supports: 10th Gen. Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor,Intel® Xeon® W-1200 ProcessorsIntel® W480E chipset 2 Fixed 2.5" drive bays with bracket (when AOC area is not occupied)Or 1 Fixed 2.5" drive bay with AOC supportUp to 64GB DDR4 ECC/non-ECC SO-DIMM,DDR4-2933MHz, in 2 DIMM slots 1 PCI-E 3.0 x16 (16/NA or 8/8); 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280; 1 M.2 E-Key CNVi/PCI-E 3.0 x1, 2230

od 698
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5 PCI-E expansion slotsDual 10GbE LAN ports 16x 2.5" drive bays. 8x SAS drives wih Broadcom® 3908 HW RAID controller and 8x SATA drives

od 3620
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Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe 12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hyprid Ports); 2 rear SATA 2.5" slots; onboard 1 M.2 NVMe 3 heavy duty fans with optimal fan speed control; 1 Air ShroudBroadcom® 3816 Controller

od 3412
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1. NEBS Level 3 Certified 2. Dual Socket P (LGA 3647):Intel® Xeon® Gold 6240R 3. 24 DIMMs; up to 1.5TB 3DS ECCDDR4-2933MHz† RDIMM 4. Up to 8 PCI-E Add-on Cards 5. Flexible LAN options 6. 6 Hot-swap 2.5" drive bays 6 NVMe/SATA ports (NVMe from CPU1) or 6 SATA ports 7. 6 Hot-swap Heavy duty 6cm PWM fans 8. 1600W Redundant Power SuppliesTitanium Level (96%) 9. GPU Support (Optional)

od 3220
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3rd Gen Intel® Xeon® Scalable processor supportIntel® C621A Chipset 5 PCI-E 4.0 x16, 1 PCI-E 4.0 x8, 2 NVMe M.2 slots 2x 5.25" peripheral drive bays 4x internal 3.5" SATA rotating drive bays for easy accessCompact and quiet operationNew front bezel with keylock for added security 1 VGA, 1 COM, 4 USB 3.0 (rear), 2 USB 3.0 (front), 7.1 HD AudioSupports up to two double width active GPUs

od 1716
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Supports Intel based bladesSupports one hot-plug Gigabit Ethernet switch / Pass-Through ModuleOne management module comes standard with each enclosureOne hot-plug management modules providing remote KVM and IPMI 2.0 functionalities

od 3078
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196 UP nodes per 42U Rack 28/14 UP nodes in 6U/3USocket H5 (LGA 1200) supportsIntel® Xeon® processor E-2300Up to 128GB ECC VLP UDIMMDDR4-3200MHz in 4 DIMM slotsUp to 2x 2.5" U.2 NVMe (7mm) drivesM.2 Interface: 1 PCI-E 3.0 x4 / SATA3M.2 Form Factor: 2280/22110M.2 Key: M-KeyDual 10GbE LAN ports via Intel i350Dedicated LAN supports IPMI 2.0Aspeed AST2500

od 847
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Kompaktný server HPE ProLiant DL365 Gen10 Plus 1U, ktorý možno prispôsobiť rôznym pracovným zaťaženiam a prostrediam, poskytuje vyšší výkon so správnou rovnováhou medzi rozšíriteľnosťou a hustotou. Server HPE ProLiant DL365 Gen10 Plus, navrhnutý pre maximálnu všestrannosť a odolnosť.

od 9074
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Key Features • High Efficiency Power &High Storage Capacity 1. Extra High-Density 4U Storage Chassis 2. High-Availability Features: Redundant,Hot-pluggable cooling system, PowerSupplies, Hot-swap drives 3. Redundant (1+1) 1400W Gold Level power supply with PMBus function 4. Maximum 3.5" hot-swap drives density 36x (24 front + 12 rear) HDD bays; E26 -

od 2314
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Popis produktu: 1. 600W High-efficiency Power Supply with Digital Switching Control 2. 8x 3.5" Hot-swap SAS / SATA DriveBays 3. 1x Slim DVD-ROM Drive (Optional) 4. Adjustable Air Shroud 5. 7x Low-profile, Full-length I/OExpansion Slots 6. 1x Serial, 2x USB Front Access I/O (optional) 7. 2x Fixed 3.5" Drive Bays 8. Full SES2 support is available with SAS motherboa

od 465
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Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable ProcessorsIntel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 2 PCI-E 4.0 x16 (LP), 1 PCI-E 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)Intel® X710 Dual port 10GBase-T LAN onboard 6x 2.5" hot-swap SATA/SAS drive bays 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)

od 8860
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Intel® PCH C621, 2 x Socket P (LGA 3647), 8 x PCIe x16 slots (Gen3 x16 link, FH, FL) for dual-slot GPU cards, 1 x PCIe x16 slot (Gen3 x16 link, LP, HL), 8 x 2.5" Hot-swap Storage Bays, 1 x M.2 socket (SATA or Gen3 x4 link, up to 2280 module), 2 x 1GbE LAN ports (RJ45, Intel I350-AM2), 1+1 Redundant 1600W 80 PLUS Platinum Power Supply

od 3859
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